Welcome message from Ming-Yi Tsai, conference co-chair

Ming Yi Tsai

doi:10.1109/IMPACT.2018.8625751

Welcome message from Ming-Yi Tsai, conference co-chair

Ming Yi Tsai^*

^*此作品的通信作者

機械工程學系(含學碩博士班)

IMAPS

研究成果: 期刊稿件 › 社論

原文	英語
文章編號	8625751
頁（從 - 到）	7
頁數	1
期刊	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
卷	2018-October
DOIs	https://doi.org/10.1109/IMPACT.2018.8625751
出版狀態	已出版 - 02 07 2018
事件	13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, 台灣持續時間: 24 10 2018 → 26 10 2018

存取文件

10.1109/IMPACT.2018.8625751

其它文件與鏈接

Link to publication in Scopus

引用此

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title = "Welcome message from Ming-Yi Tsai, conference co-chair",

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journal = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",

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Y2 - 24 October 2018 through 26 October 2018

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